【Semiconductor and Printed Circuit Board Horizontal Manufacturing Equipment】Electroless Copper Plating (Plating Process)
Uniform plating treatment is possible even in deep vias and high aspect ratio through holes!
Introducing the electroless copper plating for plating processes handled by Fujikiko Co., Ltd. Thanks to optimal spray configuration, uniform plating treatment is possible even inside blind vias and high-aspect ratio through holes. We accommodate everything from single-sided boards to flexible boards using Roll to Roll, and due to horizontal transport processing, automation from input to output is achievable. 【Features】 ■ Compatible with single-sided boards to flexible boards using Roll to Roll ■ Uniform plating treatment possible even inside blind vias and high-aspect ratio through holes due to optimal spray configuration ■ Horizontal transport processing ■ Automation from input to output is achievable *For more details, please refer to the PDF materials or feel free to contact us.
- Company：フジ機工
- Price：Other
